| abstract |
The present invention provides a multi-layer structure having improved adhesion between its layers. The multi-layer structure has in the following order: a layer of PVC, a layer of adhesive resin, and a layer of polyamide. The adhesive resin comprises organic solvent, vinyl resin, phthalate plasticizer, and leveling agent. The vinyl resin is selected from the group consisting of vinyl chloride-vinyl acetate-vinyl alcohol terpolymer (VAGH), vinyl chloride-vinyl acetate copolymer (VYHH), and vinyl chloride-vinyl acetate-maleic acid terpolymer (VMCM). Electrical conductors formed from a wire conductor and the multi-layer structure have superior adhesion between layers even after the polyamide layer absorbs moisture. |