http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-8904234-A1

Outgoing Links

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filingDate 1988-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90fe3fc8e89706f92d646240b90e0e05
publicationDate 1989-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-8904234-A1
titleOfInvention Vapour phase process and apparatus
abstract A process for treating workpieces (61) in a normally closed treatment chamber (5). The process comprises providing a pressure within the chamber which is less than atmospheric and providing an unsaturated treatment vapour within the chamber. A workpiece is then moved into the chamber to be treated by the unsaturated vapour. The process is particularly suited for the vapour phase soldering of printed circuit boards. In this case the unsaturated vapour in the chamber is heated to a temperature higher than the melting point of the solder used and the circuit boards with solder thereon are passed through the vapour in the chamber to reflow the solder. The invention is also directed toward an apparatus for carrying out the process.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-8913226-U1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-29704629-U1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007137817-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9506762-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5690751-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9506762-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9841352-A1
priorityDate 1987-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 28.