| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_260220c525b214105ee48ee2d77a5bf4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0733
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2035-041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0206 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N35-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
1988-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12b8186af4391fc22fb995c25f84be14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_257cbd3edfff7bf0bcd84eba9a528d88
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a0954163178fba4c7c948749bad808a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95d24376b4af7e48b2e085d669818e50 |
| publicationDate |
1989-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-8901282-A1 |
| titleOfInvention |
Method for the manufacture of multilayer printed circuit boards |
| abstract |
Process for manufacturing printed circuit boards in which a radiation curable material (10) is applied to a substrate (14), the material (10) is exposed to radiation and developed to expose those regions where a first conductor circuit pattern is to be formed. The covered substrate is plated and/or sputtered with a metal (24). A second layer of curable material (18) is processed like the first one, and a second metal is plated onto those regions of said electrolessly plated and/or sputtered metal coating (24) where said circuit pattern (32) is to be formed. The second metal (32) forms the remainder of said first conductor circuit pattern (32). These steps are repeated to form additional conductive circuit patterns. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9012482-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9012482-A2 |
| priorityDate |
1987-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |