| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7694eae72ae9f2431cf5c4f6081a380c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2023-405 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-467
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3672 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-467
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-40 |
| filingDate |
1987-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b850087640725e738b907f6fefcb0d1f |
| publicationDate |
1988-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-8800393-A1 |
| titleOfInvention |
Reduced-stress heat sink device |
| abstract |
A heat sink for adhesive attachment to an integrated circuit package has a base plate (2) with gapped areas dividing the plate into sectors. A series of radial fin elements (5) extend from the base plate except at the gapped areas where a bridging fin (5w) element spans the gap (10) to effectively help reduce the stresses caused by heat cycling and permit the adhesive bond to be relatively undisturbed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2339897-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005006435-A1 |
| priorityDate |
1986-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |