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filingDate 1986-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_315254a7a6b4509e6269899c36b7766e
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publicationDate 1986-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-8604617-A1
titleOfInvention System and method for depositing plural thin film layers on a substrate
abstract A sealed substrate processing path has a plural selectably isolatable vacuum deposition chambers (12, 14, 16, 18, 20 and 22) along the path. A transporter carries substrates along the path and an independently controllable sputter deposition is performed in each deposition chamber (14, 16, 18, and 20) on substrate therein. Substrates are loaded from a load chamber (12) to a first deposition chamber (14) while vacuum is maintained in the first deposition chamber (14) and load chamber (12). Substrates are transferred from a last deposition chamber (20) to an unloaded chamber (22) while a vacuum is maintained in the last (20) and unload (22) chambers. Substrates are placed in the load chamber (12) while the load (12) and first (14) chamber are isolated and are removed from the unload chamber (22) while the last (20) and unload (22) chambers are isolated. In one embodiment, substrates travel successively from the load chamber (12) to first (14) through fourth (20) deposition chambers and then to unload chamber (22). In another embodiment, substrates travel from the load chamber (12) to first (14) to second (16) to first (14) and to third (18) deposition chambers and then to the unload chamber (22).
priorityDate 1985-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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