http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023274050-A1

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_64d635fce69061d5768caf8e3fea0ab6
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F3-041
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06F3-041
filingDate 2022-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdd4fd6ccc47571cce978b82dcebe92f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f9db07d594041deb27fd293f0759aad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8228336133297cb02be606c0f4cfb6c
publicationDate 2023-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2023274050-A1
titleOfInvention Method for forming metal mesh on substrate
abstract The present invention provides a method for forming a metal mesh on a substrate. The method comprises the following steps: (1) coating one surface of the substrate with a UV curable material sequentially, including a Pd2+ composite material and a protective layer material; (2) performing exposure and development process on the coated substrate to sequentially form a UV curable layer and a PD2+ layer on the surface of the substrate according to a desired pattern; (3) reducing the PD2+ layer to the PD0 layer by means of a reducing agent; and (4) plating copper on the pattern to form the metal mesh. The method for forming a metal mesh on a substrate of the present invention does not require the process of synthesizing colloidal palladium nanoparticles alone, but instead uses PD2+ as the coating material, and then reduced to PD0 by using a reducing agent in the wet deposition process, and then used as a catalyst for electroless copper plating, and compared with the prior art, it is also helpful to improve the consistency of the whole process.
priorityDate 2021-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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