| abstract |
Provided is a laminated film capable of improving work efficiency in a process for producing a semiconductor device. The laminated film according to the present invention is such that a first separator, a first adhesive layer composed of a low-tack adhesive layer, a base material, a second adhesive layer composed of a releasable adhesive layer, and a second separator are laminated in the stated order, the 180° peeling peel strength F(1), F(2) of the first and second separators with respect to the first and second adhesive layers, the 180° peeling adhesive strength P(2) of the second adhesive layer with respect to a glass plate, and 180° peeling adhesive strength P'(2) after five minutes at 160°C (N/50 mm) satisfying the following formulas. F(2)≤F(1) P(2)≥F(1) P'(2)/P(2)<1.20P'(2)<1.00 Because "F(1)≤F(2)" in claim 1 is a typographical error for "F(2)≤F(1)" in view of the descriptions in paragraphs [0009], [0015], and [0018]-[0022], the examples, and claim 2, the examination was conducted using the reading "F(2)≤F(1)." |