| abstract |
An LED chip and a fabrication method therefor, which implements a fabrication means of integrating a current spreading layer and a PAD metal layer, that is, forming an integrated metal layer and replacing a current spreading layer with the integrated metal layer; by using a metal material containing Au when fabricating the integrated metal layer, better current spreading capability is achieved due to the low resistivity of the Au-containing metal material. In addition, during the fabrication of the PAD, a part of the surface of the integrated metal layer is exposed by means of etching, and the exposed part acts as a PAD and can be electrically connected externally. By means of the described means, the process of separately fabricating the PAD metal layer is eliminated, saving costs. In addition, unlike a conventionally fabricated PAD metal layer, a side wall of the integrated metal layer is coated in an insulating layer, enabling relatively good resistance to erosion by external water vapor, an acid/base, salt mist and so on, and improving the reliability of a chip. |