http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022228892-A1

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filingDate 2022-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b080653c1e67ccd84fb802275daee12
publicationDate 2022-11-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2022228892-A1
titleOfInvention Multi-level structure fabrication
abstract A substrate (200) is provided having a multi-layer structure (202) disposed thereon. The multi-layer structure includes a plurality of meta-layers, each meta-layer including a hard mask layer (206a-d) including a hard mask material, and a spacer layer (208a-c) on which the hard mask layer is disposed, the spacer layer including a spacer material. A replication material is disposed on a surface of the multi-layer structure. A replication pattern including a first replication feature (212a) and a second replication feature (212b, 212c) is imprinted into the replication material. The first replication feature and the second replication feature have different heights. A plurality of etching processes are performed on the replication material, the multi-layer structure, and the substrate, to obtain a substrate pattern including a first substrate feature and a second substrate feature.
priorityDate 2021-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 32.