http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022212561-A1

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8252
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
filingDate 2022-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_37b64141d263efcc521b77b9dc88ac18
publicationDate 2022-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2022212561-A1
titleOfInvention Integration of boron arsenide into power devices and semiconductors for thermal management
abstract The present embodiments relate generally to the integration of boron arsenide (BAs) and boron phosphide (BP) into semiconductor devices and electronics, including with all semiconductors (Si, Ge, InP, InAs, GaAs), metals, wide-bandgap gallium nitride (GaN, AIGaN, SiC), ultrawide-bandgap (AIN, c-BN, diamond, Ga2O3), HEMT devices, electronics, optoelectronics, photonics, or any power devices for high-performance thermal management. Embodiments successfully develop the first experimental integration and atomic structural characterization of GaN-on-BAs structure for passive cooling of GaN devices, GaN/AIGaN HEMT transistors, and RF technologies, and measured a high thermal boundary conductance of 250 MW/m2K. Importantly, experimental measurement of operating AIGaN/GaN HEMT devices confirms the substantially reduced hot spot temperature and clear advantage for using BAs versus diamond or silicon carbide as cooling substrate.
priorityDate 2021-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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