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filingDate 2022-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca40d20378941b11c173f6d4e65fca06
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publicationDate 2022-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2022200258-A1
titleOfInvention Tpu with copper as ir absorber and 3d printing process employing a copper-containing thermoplastic polymer
abstract A thermoplastic polyurethane comprises a copper compound, wherein copper is present in the polymethane in an amount of ≥ 10 ppm to ≤ 10000 ppm, based on the total weight of the polymethane, the polymethane is free from antimony and the polyurethane is free from bismuth, with the exception of bismuth originating from bismuth carboxylates, wherein the term "free from" is defined as disclosed in the description and the stated amounts of metals relate to metal atoms or ions. In an additive manufacturing process comprising fusing layers of a thermoplastic polymer build material by irradiating the polymer with a laser according to pre-determined cross-sections of an article, the laser emits a light with a wavelength of ≥ 1060 nm to ≤ 1070 nm and copper is present in the polymer in an amount of ≥ 10 ppm to ≤ 10000 ppm, based on the total weight of the polymer, wherein the stated amounts of metals relate to metal atoms or ions.
priorityDate 2021-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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