http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022199083-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_40b8a929005d0212a0488d2bbeab1803 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate | 2021-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3bfba80c2ad18eecd141c308128adce http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03195a8b899a1cb2649b4feab9b4df62 |
| publicationDate | 2022-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2022199083-A1 |
| titleOfInvention | Conductive paste and electronic device |
| abstract | The present application relates to the technical field of new materials, and provides a conductive paste and an electronic device. The conductive paste provided in the present application comprises, in percentage by weight: 5%-20% of a resin, 5%-20% of a solvent, and 70%-90% of a conductive filler; the conductive filler comprises a first conductive filler, a second conductive filler, and a third conductive filler, wherein the first conductive filler is used for increasing the filling amount of the conductive filler, the second conductive filler is used for decreasing the sintering temperature of the conductive filler, and the third conductive filler is used for slowing down erosion of tin soldering on the conductive filler during a soldering process. According to the technical solution of the present application, soldering can be implemented directly by means of a solder wire. |
| priorityDate | 2021-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 62.