| abstract |
Provided are: a resin composition that includes at least one type of resin selected from the group consisting of cyclic resins and precursors thereof and also includes a polymerizable compound having an amide bond with polymerizable groups bonded to one another with a linking group therebetween, wherein the amide bond is bonded to the linking group at a carbonyl group side thereof, and, if the polymerizable compound is used to synthesize a homopolymer, the property in which the homopolymer generates a base released from the main chain by means of heating to 250 °C is exhibited; a cured product obtained by curing said resin composition; a laminate including the cured product; a production method for the cured product; a semiconductor device including the cured product or the laminate; and a novel compound. |