| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9e1bf06f55de84b78abc9a057807f7eb |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C65-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C65-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C65-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C65-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C65-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-14 |
| filingDate |
2021-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4fc32752372531a2d69ea08392aa4381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_781f77098852c2c19f2d2e41333d355b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e566913c0bcdb6616e780b526833b8e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90c8991fe8f488525a1d2ee5e4ee0ea5 |
| publicationDate |
2022-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2022131105-A1 |
| titleOfInvention |
Polyamide resin composition for bonding to metal, method for producing same, and heterogeneous composite molded body comprising metal and molded body containing said polyamide resin composition |
| abstract |
The present invention provides a polyamide resin composition for bonding to a metal, said composition: being able to form a molded body that is superior to molded bodies containing conventional thermoplastic resins in terms of exhibiting high bonding strength to a metal; being unlikely to undergo a reduction in this strength even in a harsh environment having a high temperature and humidity; and exhibiting airtightness at a bonding interface with a metal. The present invention relates to a polyamide resin composition for bonding to a metal having a rough surface, the composition containing cellulose fibers (B) having an average fiber diameter of 10 µm or less at a quantity of 0.1-50 parts by mass relative to 100 parts by mass of a polyamide resin (A). |
| priorityDate |
2020-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |