abstract |
Provided is a photosensitive resin composition having excellent fine line adhesion, adhesion stress, and suppression of pin unevenness during hot plate drying. The photosensitive resin composition according to the present invention is characterized by containing (a) an alkali-soluble resin, (b) a photopolymerizable monomer, (c) a photoinitiator, and (e) a surfactant, wherein: said (a) alkali-soluble resin includes an alkali-soluble resin (a1) having a specific partial structure; said (b) photopolymerizable monomer includes a photopolymerizable monomer (b6) having a specific partial structure; and said (e) surfactant includes a surfactant (e1) in which 0.5 mass % of propylene glycol monomethyl ether acetate solution has a surface tension of 23.0 mN/m or less at 23 °C. |