| abstract |
An electronic module that comprises a housing that receives at least one electronic component is disclosed. The housing contains a polymer composition that includes an electromagnetic interference filler distributed within a polymer matrix, wherein the electromagnetic interference filler includes a plurality of carbon fibers and the polymer matrix contains a thermoplastic polymer. Further, the composition exhibits an electromagnetic interference shielding effectiveness of about 30 decibels or more, as determined in accordance with ASTM D4935-18 at a frequency of 5 GHz and thickness of 1 millimeter, and an in-plane thermal conductivity of about 1 W/m-K or more, as determined in accordance with ASTM E 1461-13. |