| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c999fee6428152a996011d506925c2d7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F257-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F257-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 |
| filingDate |
2021-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bda01b5f2f9c048683a900cb34ede4e |
| publicationDate |
2022-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2022102756-A1 |
| titleOfInvention |
Resin composition |
| abstract |
The present invention addresses the problem of providing a resin composition such that the minimum melt viscosity can be further reduced, the dielectric loss factor (Df) is low, and a cured article having a superior copper plating peel strength can be obtained, and provides a resin composition containing (A) a maleimide compound that has a isopropylidene group bonded to two aromatic carbon atoms in different aromatic rings, and (B) a resin having a vinyl phenyl group and/or a (meth)acryloyl group. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023171553-A1 |
| priorityDate |
2020-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |