| abstract |
Provided is a low dielectric adhesive composition containing a polyolefin resin (A), an alicyclic skeleton-containing resin (B), and an epoxy resin (C), and characterized in that at least one of the polyolefin resin (A) and the alicyclic skeleton-containing resin (B) contains a carboxyl group and/or a derivative thereof and the dielectric constant of a cured product is less than 2.5. At least the alicyclic skeleton-containing resin (B) preferably contains a carboxyl group and/or a derivative thereof. The adhesive composition has not only a low dielectric property and good adhesiveness, but also excellent thermal welding heat resistance and laser processability. |