http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022085221-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_229fd6f7a62130a11fcb15a6e5ec8e77 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07F9-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-523 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F30-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F9-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-523 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F30-02 |
| filingDate | 2021-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b40f14d412b1b51c24504c25071943e2 |
| publicationDate | 2022-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2022085221-A1 |
| titleOfInvention | Unsaturated group-containing phosphoric acid ester, thermosetting resin composition containing same, and resin material |
| abstract | The present invention addresses the problem of providing a highly heat-resistant thermosetting resin composition able to be used in a high frequency printed circuit board. Provided is a phosphoric acid ester compound having an ethylenically unsaturated bond. This compound can be added as a modifier to a thermosetting resin such as an ethylenically unsaturated bond-containing poly(phenylene ether) resin. Also provided is a thermosetting resin composition that contains this modifier and a thermosetting resin. This thermosetting resin composition has the advantage of exhibiting high heat resistance. Furthermore, it is possible to achieve excellent dielectric properties and high heat resistance, which are required of printed circuit boards for next generation communication standards. |
| priorityDate | 2020-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.