| abstract |
Provided is a resin composition that includes a polyimide precursor and/or a polyimide resin and that satisfies (A) or (B) below: (A) A polyimide structural unit includes a divalent organic group P5 and a tetravalent organic group P6, P5 or P6 includes a structural unit derived from a silicon-containing compound represented by formula (10), and the resin composition contains 25 mass% or less of silicon-containing compounds in terms of the total mass of resin; (B) a resin structural unit includes a divalent organic group P1 and a tetravalent organic group P2, P1 includes a structural unit derived from a compound represented by formula (3), and P1 or P2 includes a structural unit derived from a silicon-containing compound represented by formula (5). [In the formulas, each symbol is as defined in the specification.] |