| abstract |
Provided herein are phosphorus-based flame retardant compounds that provide both good electrical characteristics and good heat resistance characteristics when incorporated into PCB compositions. In particular, provided herein are new organophosphorus-based polymers that contain C=C double bonds, which allows them react with other components (for example, C=C bond capped polyphenyl ether, unsaturated hydrocarbon resin, bismaleic imide, etc. ) to form a crosslinked network. |