http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021214255-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D233-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D249-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D251-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D251-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D233-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D251-30 |
| filingDate | 2021-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9fd3893ddbffe829159ce2d339412849 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ad430e054e068e2dd67edacf8a77fb6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aef5a8e024d25e2248660ca358f15caa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f61da0bd0b5c59ccabf53ee2b2bda7f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_377d9db9a35b513e62342e6057e42bf2 |
| publicationDate | 2021-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2021214255-A1 |
| titleOfInvention | Acidic aqueous composition for electrolytically depositing a copper deposit |
| abstract | The invention relates to an acidic aqueous composition for electrolytic copper plating, the composition comprising (i) copper (II) ions, (ii) one or more than one suppressor consisting of or comprising one single N-heteroaromatic mono-ring, said mono-ring comprising at least two ring nitrogen atoms and more than one substituent covalently connected to one of said ring nitrogen atoms and/or a ring carbon atom, wherein said substituent independently is or comprises one or more than one linear or branched polyalkylene glycol moiety, and/or one or more than one linear or branched polyalkylene glycol block polyalkylene glycol, or random polyalkylene glycol moiety, with the proviso that if said suppressor comprises a OH group, then it is a terminal OH group of said polyalkylene glycol moiety, polyalkylene glycol block polyalkylene glycol, and random polyalkylene glycol moiety, respectively, and said suppressor does not comprise NH2 groups, halogen atoms, and sulfur atoms; a method of electrolytic copper plating using the acidic aqueous composition; and specific suppressors as defined above. |
| priorityDate | 2020-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 85.