| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b5231c81de1a546c1d6a9325c10910ce |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05609
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80211
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05567
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05571
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83409
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80359
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0807 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate |
2020-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c51e82e1f9ba98b3400f651a16aa0cc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_866e9ff842afbd99f5ebb55121396021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74f500f4c9689ff31ab9673fc56b2f9b |
| publicationDate |
2021-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2021141660-A1 |
| titleOfInvention |
Structure for bonding and electrical contact for direct bond hybridization |
| abstract |
A direct bond hybridization (DBH) method is provided. The DBH method includes preparing a first underlying layer, a first contact layer disposed on the first underlying layer and a first contact electrically communicative with the first underlying layer and protruding through the first contact layer, preparing a second underlying layer, a second contact electrically communicative with the second underlying layer and formed of softer material than the first contact and a second contact layer disposed on the second underlying layer and defining an aperture about the second contact and a moat at least partially surrounding the second contact and bonding the first and second contact layers whereby the first contact contacts the second contact such that the second contact deforms and expands into the moat. |
| priorityDate |
2020-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |