| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2037-268
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3157
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2020-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5040f708f83a5298a98d1e2404a548e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_acae31c95f364755fef427298b3c461d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_252435aeba05055a3f30af15368c9341
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2de109cc58448f0690a01edbb31a1d7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c37832c4c38c6fa48bdcd202f67dd280 |
| publicationDate |
2021-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2021132679-A1 |
| titleOfInvention |
Curable resin film, composite sheet, and method for manufacturing semiconductor chip |
| abstract |
The present invention addresses the problem of providing a curable resin film with which it is possible to form a protective film having excellent coverage on the side surfaces and bump formation surface of a semiconductor chip. In order to overcome the aforesaid problem, the present invention provides a curable resin film that satisfies requirement (I) below and is used to form a cured resin film serving as a protective film on the side surfaces and bump formation surface of a semiconductor chip, the bump-formation surface having bumps provided thereon. <Requirement (I)> A test piece of the curable resin film having a diameter of 25 mm and a thickness of 1 mm is subjected to strain at a temperature of 90°C and frequency of 1 Hz, and the storage elastic modulus of the test piece is measured. The value of X calculated using formula (i) below is at least 19 and less than 10,000, where Gc1 is the storage elastic modulus of the test piece when the strain of the test piece is 1% and Gc300 is the storage elastic modulus of the test piece when the strain of the test piece is 300%. Formula (i) X=Gc1/Gc300 |
| priorityDate |
2019-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |