http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021131383-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fb0b77f42ce199bf06dc1fd0a7e29197 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate | 2020-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc5569080bfbc7e64d7a63a8184f67cc |
| publicationDate | 2021-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2021131383-A1 |
| titleOfInvention | Polishing composition, and method for polishing silicon wafer |
| abstract | Provided is a polishing composition which can further reduce micro defects and haze of a semiconductor wafer after the polishing of the semiconductor wafer and has a satisfactory ability to hydrophilize a semiconductor wafer. The polishing composition comprises abrasive grains, a basic compound and a water-soluble polymer that is a copolymer produced by polymerizing vinylpyrrolidone with a vinyl alcohol-based resin having a 1,2-diol structural unit represented by general formula (A). [In the formula, R1, R2 and R3 independently represent a hydrogen atom or an organic group; X represents a single bond or a bonding chain; and R4, R5 and R6 independently represent a hydrogen atom or an organic group. |
| priorityDate | 2019-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 55.