| abstract |
Provided is a chemical mechanical polishing solution, which comprises abrasive particles, a catalyst, a stabilizer, a corrosion inhibitor containing both an amino sugar and a cyclic alcohol structure, an oxidant, water and a pH adjusting agent. Provided is a chemical mechanical polishing solution, which can reduce the static corrosion rate of tungsten while ensuring a high polishing rate of tungsten and an intermediate polishing rate of silicon oxide, thereby improving the surface condition of a metal after same is polished and improving the yield. |