http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021118911-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a6ede215ef4c9333d8e19a358a5f4867 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B2027-0174 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B2027-0178 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16148 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-167 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B27-0172 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B27-01 |
| filingDate | 2020-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2021118911-A1 |
| titleOfInvention | Display systems having monolithic arrays of light-emitting diodes |
| abstract | An electronic device may include a display having a monolithic array of light-emitting diodes mounted to a surface of a substrate layer. The diodes may include contact pads. Driver circuitry may independently drive each of the diodes in the array using drive signals. The driver circuitry may be formed on a driver integrated circuit. Bond pads may be formed on a surface of the integrated circuit. Copper pillars may be grown on the bond pads. In another suitable arrangement, the driver circuitry may be formed on a driver printed circuit board coupled to an interposer by a flexible printed circuit. The interposer may include bond pads and copper pillars grown on the bond pads. The contact pads on each of the diodes may be simultaneously bonded to the copper pillars. A surface of the substrate layer may be patterned to form light redirecting elements if desired. |
| priorityDate | 2019-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.