http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021110019-A1
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_535127fc110f647288d5f9bf42fcc199 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-18 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-48 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-40 |
filingDate | 2020-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98df07a3758178fe9b1ade97c2ba5704 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b204d5f6ae95faa933d69b15a80de38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2f1ac49d09ec49af49495e22bc71a98 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e923977ef20499d18b9c6ddfe0c9eb34 |
publicationDate | 2021-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | WO-2021110019-A1 |
titleOfInvention | Led light emitting device and manufacturing method therefor |
abstract | An LED light emitting device and a manufacturing method therefor, relating to the technical field of LEDs, for use in solving the technical problems of high cost and poor structural stability of LED light emitting devices. The LED light emitting device comprises: a carrier (1), the carrier (1) comprising a conductive layer (2); and an LED chip (6), the LED chip (6) being provided on the carrier (1), an electrode (61) of the LED chip (6) being flip-chip bonded to and conductively connected to the conductive layer (2), wherein the conductive layer (2) comprises a copper layer (5) and a soldering area (3) provided on the copper layer (5), and any of the soldering area (3) and the electrode (61) comprises a tin layer and does not comprise gold and nickel. The LED light emitting device and the manufacturing method therefor is used for reducing the cost of LED light emitting devices and improving the structural stability of LED light emitting devices. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114284402-A |
priorityDate | 2019-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.