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filingDate 2020-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98df07a3758178fe9b1ade97c2ba5704
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publicationDate 2021-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2021110019-A1
titleOfInvention Led light emitting device and manufacturing method therefor
abstract An LED light emitting device and a manufacturing method therefor, relating to the technical field of LEDs, for use in solving the technical problems of high cost and poor structural stability of LED light emitting devices. The LED light emitting device comprises: a carrier (1), the carrier (1) comprising a conductive layer (2); and an LED chip (6), the LED chip (6) being provided on the carrier (1), an electrode (61) of the LED chip (6) being flip-chip bonded to and conductively connected to the conductive layer (2), wherein the conductive layer (2) comprises a copper layer (5) and a soldering area (3) provided on the copper layer (5), and any of the soldering area (3) and the electrode (61) comprises a tin layer and does not comprise gold and nickel. The LED light emitting device and the manufacturing method therefor is used for reducing the cost of LED light emitting devices and improving the structural stability of LED light emitting devices.
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