http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021108046-A1

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filingDate 2020-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a7182d2cdcbb6b7dfa938b985044fdd
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publicationDate 2021-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2021108046-A1
titleOfInvention Led array having transparent substrate with conductive layer for enhanced current spread
abstract In a flip-chip LED assembly having an array of LEDs formed on the same substrate, different LEDs of the array have different distances to the n-contacts of the assembly. This may cause current crowding as current has to spread from the n-contacts through the substrate to each the farthest LEDs of the LED array, requiring LEDs that are farther away to be driven with a higher voltage in order to receive a desired amount of current. To spread current more evenly through the LED assembly and reduce a voltage difference between the closest and farthest LEDs of the array, a current spreading layer having a conductive material (e.g., a conductive oxide) is formed on a surface of the substrate of the LED assembly. The current spreading layer may be a bulk layer or be patterned to increase light extraction from the LEDs of the array.
priorityDate 2019-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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