http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021107409-A1
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6f04529fbaf306be549bda5a7d916fcf |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
filingDate | 2020-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5562fee53b42ed12137e289e23637bfd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8bce2d0d09508e12dc445f1898adcd81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3b65b2abb5237d4df1946a4eaa4e7da http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a75775c71fba1b96c08585d4b93658f2 |
publicationDate | 2021-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | WO-2021107409-A1 |
titleOfInvention | Method for filling via hole of circuit board and circuit board manufactured using same |
abstract | The present invention provides a method for filling a via hole of a circuit board with a conductive material, comprising the steps of: forming a via hole in a board; forming an electroless plating layer with a predetermined thickness on the inner surface of the via hole by means of electroless plating; performing bridge plating such that a bridge is formed in a partial area inside the via hole by means of electroplating that applies a pulse waveform to the electroless plating layer; and performing via hole fill plating in the via hole on which the bridge plating has been formed by electroplating, wherein the bridge plating and the via hole fill plating are performed using the same plating solution as each other. |
priorityDate | 2019-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 117.