| abstract |
Provided is a curable resin composition which includes: at least one resin selected from the group consisting of a polyimide precursor, and a polybenzoxazole precursor; a basic compound; and a solvent, wherein the composition has a pH of 7.00-10.00. Also provided are a method for producing the curable resin composition, a cured film obtained by curing the curable resin composition, a laminate including the cured film, a method for producing the cured film, and a semiconductor device including the cured film or the laminate. |