| abstract |
Conductive metal frame for a power electronic module comprising at least first and second power semiconductor components each having upper and lower faces, and connectors (12) for connecting these power semiconductor components to exterior electrical circuits and to at least one radiator (14) in order to remove, via a conductive metal frame, the heat flux generated by the power semiconductor components, the connectors, the radiator and the conductive metal frame (10A, 10B) forming a single three-dimensional part of a single material to an interior surface of which are intended to be fastened, via their lower faces, the first and second power semiconductor components, a central fold line (10C) being provided so that, once the conductive metal frame has been folded on itself so as to enclose the first and second power semiconductor components, a double-sided cooling assembly is produced. |