| abstract |
The present invention relates to an epoxy composite composition and a semiconductor package comprising same, and, more specifically, to: an epoxy composite composition having high dispersibility, a high glass transition temperature (including Tg less that does not exhibit a glass transition temperature), and a low coefficient of thermal expansion by including an amino phenol-based epoxy resin and spherical silica having a surface covalently bonded to a silane compound; and a semiconductor package comprising same. |