| abstract |
Provided is a thermally conductive silicone composition from which a cured product having excellent thermal conductivity and light weight can be obtained, and which has low viscosity and is thus easy to process. The thermally conductive silicone composition comprises: (A) an organopolysiloxane having at least two alkenyl groups in one molecule; (B) an organohydrogenpolysiloxane having, in one molecule, at least two hydrogen atoms directly bonded to a silicon atom; (C) a thermally conductive filler including a magnesium oxide, an aluminum oxide, and an aluminum hydroxide; (D) a dimethylpolysiloxane having one molecular chain terminal sealed with a trialkoxy group; (E) a platinum group metal-based curing catalyst; and (F) an addition reaction control agent, wherein the thermally conductive filler of component (C) contains 20-40 mass% of magnesium oxide, 40-60 mass% of aluminum oxide, and 10-30 mass% of aluminum hydroxide with respect to the total amount of component (C). |