| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a06d66365c858509215548c1a46edcba |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2203-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2203-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C44-422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2201-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2995-0013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2105-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C44-3446
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2300-22 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-0066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C44-083
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-0085 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K105-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C44-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C44-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C44-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J9-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J9-08 |
| filingDate |
2020-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc73cc5f7962969dabf3e03460baa068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1217feae7555d98b20ef9b7aee2f2a0e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06799fc3b55c256ac19c7f85d7155bad |
| publicationDate |
2021-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2021074823-A1 |
| titleOfInvention |
Improved through-plane thermal conductivity using foam injection molding with core-back technology |
| abstract |
In various aspects, the disclosure relates to a method of forming a molded article comprising: combining, to form a blend, a polymer base resin and a thermally conductive filler, wherein the thermally conductive filler comprises a platelet filler having a thickness between 100 nm and 10 microns; feeding the blend to a mold cavity of a suitable molding apparatus, wherein the mold cavity has a mold portion that may be retracted in a through-plane direction; foaming the blend to allow a pressure drop; and retracting the mold portion in the through-plane direction to provide the molded article. |
| priorityDate |
2019-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |