| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e198e04887a7694a6c630f6111bfe793 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3218
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-04 |
| filingDate |
2020-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_68f937b3e126dda5f93bbe0caec07792
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eaf3edefe395605f853a8dd3ebcd5b1b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_73a423efc5944684b6924e9f6ab84b70 |
| publicationDate |
2021-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2021071158-A1 |
| titleOfInvention |
Epoxy resin composition |
| abstract |
The present invention relates to an epoxy resin composition which can be applied to a sealing material for high-temperature operated power semiconductor devices. |
| priorityDate |
2019-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |