Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1bba710e7aaa56d8ab15a910fcd3dc5f |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01S7-4814 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F2202-105 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01S7-4817 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-2955 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01S17-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01S7-4818 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01S7-481 |
filingDate |
2020-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6995c46602499375ed2ddfeb1cb98dae |
publicationDate |
2021-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2021067911-A1 |
titleOfInvention |
Optical phased array structure and fabrication techniques |
abstract |
Methods of manufacturing and operating a monolithically integrated optical phase array (OP A) chip device, and the device itself. A three-dimensional (3-D) integrated optical phase array (OP A) chip device. A system of complementary metal-oxide-semiconductor (CMOS) electronics integrated with a three-dimensional integrated optical array chip device. A method of three-dimension photonic integration to improve optical power in optical phase arrays. |
priorityDate |
2019-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |