| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7542cdde926ccc0ad7b27ea92c083088 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68318 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-98
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53266 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate |
2020-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_707084ffb91624ae46b6587e959fc265 |
| publicationDate |
2021-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2021055032-A1 |
| titleOfInvention |
Method for temporarily bonding a semiconductor substrate to a carrier |
| abstract |
A method for fabricating a semiconductor device includes providing a semiconductor substrate and bonding the semiconductor substrate to a carrier. The semiconductor substrate includes an inert material layer and a semiconductor layer on the inert material layer. The semiconductor substrate is bonded to the carrier such that the inert material layer is between the carrier and the semiconductor substrate. By including an inert material layer between the carrier and the semiconductor substrate, a barrier against diffusion for any bonding agents used to bond the semiconductor substrate to the carrier is formed, thereby preserving the integrity of the semiconductor layer and allowing for the easy removal of the semiconductor substrate from the carrier. |
| priorityDate |
2019-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |