| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d9cb217f83556ce2a418344c2d485415 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34 |
| filingDate |
2020-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b466e034920b48d285df72573420bff3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae00483ea2576e0d083df481145cc477
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62f5ddc21d1494626121301aa91e90f3 |
| publicationDate |
2021-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2021054476-A1 |
| titleOfInvention |
Method for manufacturing flexible electronic device |
| abstract |
Disclosed is a method for manufacturing a flexible electronic device, the method comprising: (a) a step for applying, onto a substrate, a polyimide precursor composition which contains a polyimide precursor, and needle-like fine particles and a solvent in an amount greater than 2 parts by mass and less than 33 parts by mass with respect to 100 parts by mass of the polyimide precursor; (b) a step for heating the polyimide precursor composition on the substrate to manufacture a laminate in which a polyimide film is laminated on the substrate; (c) a step for forming, on the polyimide film of the laminate, at least one layer selected from among a conductor layer and a semiconductor layer; and (d) a step for peeling the substrate and the polyimide film by using an external force. A flexible electronic device can be manufactured by a simple method using an industrially simple apparatus. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022209591-A1 |
| priorityDate |
2019-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |