http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021039202-A1

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filingDate 2020-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_885ac0f7dee0a9278f13dd7605575c0a
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publicationDate 2021-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2021039202-A1
titleOfInvention Thermally conductive resin and heat-dissipating structure
abstract The present invention aims to provide a thermally conductive resin having excellent thermal conductivity. This thermally conductive resin: comprises resin, alumina fibers included in the resin, and inorganic oxide particles covering the alumina fibers and having a higher thermal conductivity than the resin; and is characterized by the alumina fibers being in contact via the inorganic oxide particles.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114156430-A
priorityDate 2019-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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