http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021033329-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0c20dac5f1a44475c96d2db944e79786 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-66 |
| filingDate | 2019-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cb4cbec201fd6367bc8075e24c39ede http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6fed3a5997aec23bb2623f4ebcd6354d |
| publicationDate | 2021-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2021033329-A1 |
| titleOfInvention | Epoxy resin composition |
| abstract | The present invention relates to: an epoxy resin composition that cures in a short amount of time even under low-temperature conditions to produce a cured product having a low glass transition point (Tg) and a high pull strength; a sealing material containing the same; a cured product obtained by curing the composition; and an electronic part including the cured product. This epoxy resin composition, once cured, produces a cured product having a low Tg and high pull strength, and is therefore extremely useful as an adhesive agent, a sealing material or a dam agent for a semiconductor or an electronic part. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7217566-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7217565-B1 |
| priorityDate | 2019-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 301.