| abstract |
The present invention relates to a compound for an encapsulation film and a composition thereof, and a film, an organic light-emitting device and an encapsulation method. The compound has the following formula, and the composition comprises the compound, a propenyl compound curable under light and heat, and one or more compounds that produce a free radical and produce an acid under light or heat. The encapsulation film comprises the composition as a film of an organic layer. The organic light-emitting device comprises the film. The encapsulation method involves encapsulating the organic light-emitting device using the encapsulation film. The composition containing the compound of the present invention serves as an organic layer. An encapsulation film for the organic light-emitting device is manufactured by repetitively and alternately laminating an inorganic layer and the organic layer, thereby enabling isolation of the organic layer in the organic light-emitting device from oxygen and water, and therefore, a film that protects the organic light-emitting device is realized. Moreover, the film, in which the inorganic layer and the organic layer are repetitively and alternately laminated, exhibits the properties of a low water vapor permeation rate and bendability. |