| abstract |
While an electromagnetic shielding film is being formed on an electronic component, equipped with a body that has a bonding face and an external connection terminal disposed on the bonding face, so as to cover the exterior surface of the body, this carrier film for the electronic component is used to protect the bonding face and the external connection terminal, the carrier film being provided with: a first resin layer having a plurality of holes therein; and a second resin layer that is disposed on the first resin layer, that exhibits high aggregability and adhesiveness, and that is capable of undergoing elastic deformation or plastic deformation. |