| abstract |
In an aspect, provided is a polishing liquid composition capable of improving polishing selectivity while ensuring the polishing speed of a silicon oxide film. An aspect of the present disclosure pertains to a polishing liquid composition which is for a silicon oxide film and contains cerium oxide particles (component A), a water-soluble polymer (component B), an anionic condensate (component C), and an aqueous medium, wherein the component B is a polymer containing a structural unit b1 represented by formula (I). |