| abstract |
The present invention uses a solder paste that contains a specific solder powder and a specific flux. This solder powder contains a solder alloy which has an alloy composition comprising not less than 10 ppm by mass and less than 40 ppm by mass of As and at least one of 0-10,000 ppm by mass of Bi, 0-5100 ppm by mass of Pb and 0-3000 ppm by mass of Sb, with the remainder comprising Sn, and the solder alloy satisfies formula (1) and formula (2). Formula (1): 300 ≤ 3As+Sb+Bi+Pb Formula (2): 0.1 ≤ {(3As+Sb)/(Bi+Pb)}×100 ≤ 200 In formula (1) and formula (2), As, Sb, Bi and Pb denote the content values (ppm by mass) of these components in the alloy composition. |