| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d6130c4f3325f6b7d043ce632cb6fc5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d437b2abb428aeb59000da0b15dc2f98 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83895
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80895 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K20-233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K20-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K20-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K20-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate |
2020-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9f9db1acda0ff770b11e221b60690a7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cbf04cdbe0bb4cb0dfcbac424c47a09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e65f0e4a315dca1ea6066f985da44e1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a2104566c76265ecc400ef38e50bb53
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d022c1942a9e7546e455ad319dd69ff8 |
| publicationDate |
2020-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2020241047-A1 |
| titleOfInvention |
Joining method and structure |
| abstract |
Provided is a joining method that causes little damage to the materials to be joined, does not require a high pressure reduction process, enables maskless area selective application, and makes it possible to realize a high joining strength and connection reliability even in joint portions in a high-temperature region by low-temperature joining performed by simple operations in high-production facilities.　The joining method comprises: a first step of forming a noble metal thin film having volume diffusion coefficient larger than the volume diffusion coefficient of the base material of the materials to be joined by using an atomic layer deposition method at a vacuum degree of 1.0 Pa or more on at least one of the joining surfaces of the two materials to be joined having a smooth surface; a second step of forming a laminate by stacking the two materials to be joined so that the joining surfaces of the two materials to be joined are connected to each other through the thin film; and a third step of heating the laminate to join the two materials together. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022138280-A1 |
| priorityDate |
2019-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |