| abstract |
This method for manufacturing a wiring board comprises: a resin supplying step for filling a gap between a FC-BGA wiring board (1) and an interposer (3) with underfill (2A) after performing a bonding step for bonding a bonding part (18a) of the FC-BGA wiring board (1) and a bonding part (18b) of the interposer (3); a resin curing step for curing the underfill (2A); and a support body separating step for separating a support body (5) from the interposer (3), wherein the steps are set to be performed such that the support body separating step is performed, the resin supplying step is performed, and then the resin curing step is performed. |