| abstract |
(Co)polymer matrix composites including a porous (co)polymeric network; a multiplicity of thermally-conductive particles, and a multiplicity of endothermic particles distributed within the (co)polymeric network structure; wherein the thermally-conductive particles and endothermic particles are present in a range from 15 to 99 weight percent, based on the total weight of the particles and the (co)polymer (excluding the solvent). Optionally, the (co)polymer matrix composite volumetrically expands by at least 10% of its initial volume when exposed to a temperature of at least 135 °C. Methods of making and using the (co)polymer matrix composites are also disclosed. The (co)polymer matrix composites are useful, for example, as heat dissipating or heat absorbing articles, as fillers, thermal interface materials, and thermal management materials, for example, in electronic devices, more particularly mobile handheld electronic devices, power supplies, and batteries. |