http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020226116-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4e58a7247d4c843be828cff866761ddd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-60 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12 |
| filingDate | 2020-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db48e1b285f38010aeb02dc548d1e5a7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e748ed80a289096f3f1d3b7dab19b212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb2506997edc0734a6fc0f171b663ea7 |
| publicationDate | 2020-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2020226116-A1 |
| titleOfInvention | Structure provided with copper plating layer or copper alloy plating layer |
| abstract | This structure is provided with a copper plating layer or copper alloy plating layer in which formation of a Kirkendall void is suppressed. The copper plating layer or copper alloy plating layer is formed by carrying out an electroplating treatment at a predetermined first negative electrode current density using a copper or copper alloy electroplating bath and by subsequently completing the electroplating treatment after changing the density to a second negative electrode current density which is lower than the first negative electrode current density. The first negative electrode current density is a single negative electrode current density used during the electroplating treatment until the density is changed to the second negative electrode current density, or is the average negative electrode current density in an electroplating treatment using a combination of multiple negative electrode current densities, and the predetermined first negative electrode current density is 5A/dm2 or higher. The layer formed after the change to the second negative electrode current density is the surface part of the copper plating layer or copper alloy plating layer, and the thickness of the surface part is 0.05 µm to 15 µm. |
| priorityDate | 2019-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 270.