| abstract |
Carriers (C) are cleaned with a prescribed frequency by using a first robot (121) to introduce a carrier (C) being held in a load lock chamber (13) into a reaction chamber (111) without an unprocessed wafer (WF) mounted thereupon, supplying a cleaning gas while maintaining the reaction chamber (111) at a prescribed cleaning temperature, and using the first robot (121) to transport the carrier (C) that was cleaned in the reaction chamber (111) to the load lock chamber (13). |